Contract 33131220P00437793
Digicom Electronics Inc. · Smithsonian Institution · December 26, 2019
Digicom Electronics Inc. was awarded a federal contract by Smithsonian Institution on December 26, 2019 for $365,000 of work in printed circuit assembly (electronic assembly) manufacturing. Performance is in Oakland, CA. It was awarded under full and open competition. The contract has been modified 1 time since the base award It uses firm fixed-price contract pricing. The most recent modification was on December 26, 2019.
Contract details
- PIID
- 33131220P00437793
- Award type
- Purchase Order
- Pricing
- Firm Fixed Price
- Set-aside
- No Set Aside Used.
- Competition
- Not Competed Under Sap
- NAICS
- 334418 · Printed Circuit Assembly (Electronic Assembly) Manufacturing
- Product / service
- Specialized Semiconductor, Microcircuit, And Printed Circuit Board Manufacturing Machinery
- Place of performance
- Oakland, CA
- First action
- December 26, 2019
- Latest action
- December 26, 2019
Description
ROACH2 ASSEMBLIES
Modification timeline
-
December 26, 2019Mod P00001$3.6K
-
December 26, 2019Base award$361.1K
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| 10 | General Dynamics Land Systems Inc. | 38 | $63.16M |
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Frequently asked questions
What is contract 33131220P00437793?
Contract 33131220P00437793 is a federal contract awarded to Digicom Electronics Inc. by Smithsonian Institution on December 26, 2019 for $365,000 of work classified under PRINTED CIRCUIT ASSEMBLY (ELECTRONIC ASSEMBLY) MANUFACTURING. It has been modified 1 time since the base award.
Who won contract 33131220P00437793?
Digicom Electronics Inc. won contract 33131220P00437793 from Smithsonian Institution.
How much is contract 33131220P00437793 worth?
Contract 33131220P00437793 has obligated $365,000 to date.