Contract NNX17GD40P
Shin-Etsu Handotai America, Inc · National Aeronautics And Space Administration · April 17, 2017
Shin-Etsu Handotai America, Inc was awarded a federal contract by National Aeronautics And Space Administration on April 17, 2017 for $27,000 of work in semiconductor and related device manufacturing. Performance is in Vancouver, WA. It was awarded under full and open competition. The contract has been modified 1 time since the base award It uses firm fixed-price contract pricing. The most recent modification was on September 22, 2017.
Contract details
- PIID
- NNX17GD40P
- Award type
- Purchase Order
- Pricing
- Firm Fixed Price
- Set-aside
- No Set Aside Used.
- Competition
- Not Competed Under Sap
- NAICS
- 334413 · Semiconductor And Related Device Manufacturing
- Product / service
- Laboratory Equipment And Supplies
- Place of performance
- Vancouver, WA
- First action
- April 17, 2017
- Latest action
- September 22, 2017
Description
IGF::OT::IGF SILICON ON INSULATOR (SOI) WAFERS, WITH 450 NM THICK SILICON DEVICE LAYERS, AS SUBSTRATES FOR ULTRASENSITIVE BOLOMETRIC DETECTORS.
Modification timeline
-
September 22, 2017Mod 1$40
-
April 17, 2017Base award$27.0K
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Frequently asked questions
What is contract NNX17GD40P?
Contract NNX17GD40P is a federal contract awarded to Shin-Etsu Handotai America, Inc by National Aeronautics And Space Administration on April 17, 2017 for $27,000 of work classified under SEMICONDUCTOR AND RELATED DEVICE MANUFACTURING. It has been modified 1 time since the base award.
Who won contract NNX17GD40P?
Shin-Etsu Handotai America, Inc won contract NNX17GD40P from National Aeronautics And Space Administration.
How much is contract NNX17GD40P worth?
Contract NNX17GD40P has obligated $27,000 to date.